Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package

ABSTRACT

Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No.10-2010-0038180, filed on Apr. 23, 2010, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND

1. Field

The present disclosure relates to lead frames for light emitting devicepackages used to package a plurality of light emitting device chips,light emitting device packages, and illumination apparatuses employingthe light emitting device packages.

2. Description of the Related Art

Light emitting diodes (LEDs) are semiconductor devices which constitutea light emitting source through a PN junction of a compoundsemiconductor and thus may realize various colors of lights. LEDs havelong lifetime, are easily made to be small and lightweight, have strongdirectivity of light, and thus are driven with low voltage. Also, LEDsare strong in terms of resistance to shock and vibration, do not requirea warm-up time or complicated operation, and are easily packaged invarious ways. Thus, LEDs may be applied in various fields.

In general, light emitting device chips such as LEDs are formed byperforming a first packaging process and a second packaging process. Inthe first packaging process, phosphors and lenses are mounted on a leadframe to prepare a plurality of light emitting device chips. In thesecond packaging process, the plurality of light emitting device chipsare mounted on a circuit board along with other devices to prepare acircuit.

In order to illuminate the light emitting devices such as LEDs,manufacturing costs thereof need to be reduced. In this regard, researchinto reducing the material cost and simplifying a manufacturing processis being widely conducted.

SUMMARY

Provided are lead frames for light emitting device packages which maysimplify a packaging process by improving a package structure of lightemitting device chips, light emitting device packages, and illuminationapparatuses employing the light emitting device packages.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to an aspect of the present invention, a lead frame for alight emitting device package includes: a plurality of mounting portionson which a plurality of light emitting device chips are mounted,respectively; a plurality of connection portions for circuit connectingthe plurality of light emitting device chips; a terminal portionextended from at least one of the plurality of connection portions; anda plurality of cleavage portions for connecting the plurality ofmounting portions, the plurality of connection portions, and theterminal portion, wherein the cleavage portions are cut after theplurality of light emitting device chips are mounted.

The plurality of connection portions may include intermediate connectionportions, a first connection portion, and a second connection portion,the intermediate connection portions connecting the plurality of lightemitting device chips in series, the first connection portionelectrically connected to a first electrode of the light emitting devicechip disposed at the foremost of a series circuit in which the pluralityof light emitting device chips are arranged in series, and the secondconnection portion electrically connected to a second electrode of thelight emitting device chip disposed at the rearmost of a series circuitin which the plurality of light emitting device chips are arranged inseries, and wherein the terminal portion includes a first terminalextended from the first connection portion and a second terminalextended from the second connection portion.

The first connection portion, the intermediate connection portions, andthe second connection portion may be arranged in a line, the firstterminal may include a first front terminal disposed at the foremost inthe line arrangement and a first rear terminal disposed at the rearmostin the line arrangement, the second terminal may include a second frontterminal disposed at the foremost in the line arrangement and a secondrear terminal disposed at the rearmost in the line arrangement, and theplurality of connection portions may include a first extension portionextended from the first connection portion to the first rear terminalalong one side of the line arrangement and a second extension portionextended from the second connection portion to the second front terminalalong the other side of the line arrangement.

The plurality of connection portions may include the first connectionportion commonly connected to the first electrodes of the plurality oflight emitting device chips and the second connection portion commonlyconnected to the second electrodes of the plurality of light emittingdevice chips so as to connect the plurality of light emitting devicechips in parallel.

According to another aspect of the present invention, a light emittingdevice package includes: a plurality of light emitting device chips; anda lead frame comprising: a plurality of mounting portions to which theplurality of light emitting device chips are mounted; a plurality ofconnection portions for circuit connecting the plurality of lightemitting device chips; and a terminal portion extended from at least oneof the plurality of connection portions.

The plurality of light emitting device chips may include first andsecond light emitting device chips, the plurality of connection portionsmay include a first connection portion electrically connected to a firstelectrode of the first light emitting device chips, intermediateconnection portions electrically connected to a second electrode of thefirst light emitting device chip and a first electrode of the secondlight emitting device chip, and a second connection portion electricallyconnected to a second electrode of the second light emitting devicechip, and the terminal portion may include a first terminal extendedfrom the first connection portion and a second terminal extended fromthe second connection portion.

The plurality of connection portions may include intermediate connectionportions electrically connecting the plurality of light emitting devicechips in series, a first connection portion electrically connected to afirst electrode of the light emitting device chip disposed at theforemost of a series circuit in which the plurality of light emittingdevice chips are arranged in series, and a second connection portionelectrically connected to a second electrode of the light emittingdevice chip disposed at the rearmost of a series circuit in which theplurality of light emitting device chips are arranged in series, and theterminal portion includes a first terminal extended from the firstconnection portion and a second terminal extended from the secondconnection portion.

The plurality of light emitting device chips may be arranged in a line.

The first terminal may include a first front terminal disposed at theforemost of the plurality of light emitting device chips in the linearrangement and a first rear terminal disposed at the rearmost of theplurality of light emitting device chips in the line arrangement, thesecond terminal may include a second front terminal disposed at theforemost of the plurality of light emitting device chips in the linearrangement and a second rear terminal disposed at the rearmost of theplurality of light emitting device chips in the line arrangement, andthe plurality of connection portions may include a first extensionportion extended from the first connection portion to the first rearterminal along one side of the plurality of light emitting device chipsin the line arrangement and a second extension portion extended from thesecond connection portion to the second front terminal along the otherside of the plurality of light emitting device chips in the linearrangement.

The lead frame may be in the form of a long bar extended in a directionof the first and second extension portion.

The first extension portion and the second extension portion may bebonded to each other by the intermediate connection portions and bondingmembers formed of an insulating material.

The bonding members may be extended to the outside of at least a part ofthe first extension portion and the second extension portion.Furthermore, the bonding members may be integrally formed withreflective cavities as a single body, the reflective cavities reflectinglight emitted from the plurality of light emitting device chips.

The light emitting device package may further include reflectivecavities that reflect light emitted from the plurality of light emittingdevice chips, wherein the reflective cavities connect the firstconnection portion, the intermediate connection portions, and the secondconnection portion to each other.

The plurality of connection portions may include the first connectionportion commonly connected to first electrodes of the plurality of lightemitting device chips and the second connection portion commonlyconnected to second electrodes of the plurality of light emitting devicechips so as to connect the plurality of light emitting device chips inparallel, and the terminal portion may include a first terminal extendedfrom the first connection portion and a second terminal extended fromthe second connection portion.

At least a part of the lead frame may be insulation-coated.

The plurality of mounting portions may be prepared in a part of theplurality of connection portions.

The plurality of mounting portions, the plurality of connectionportions, and the terminal portion may be formed of the same material.

The plurality of mounting portions may be disposed between the pluralityof connection portions, and the plurality of mounting portions and theplurality of connection portions may be formed of an insulatingmaterial. The plurality of mounting portions may be formed of a heatconducting material.

The plurality of light emitting device chips may be each wire-bonded tothe plurality of connection portions. The plurality of light emittingdevice chips may be each flip chip bonded to the plurality of connectionportions.

The light emitting device package may further include reflectivecavities that reflect light emitted from the plurality of light emittingdevice chips.

The light emitting device package may further include a lens that bendslight emitted from the plurality of light emitting device chips.

The plurality of light emitting device chips may be covered with atransmissible resin. The transmissible resin may include a fluorescentmaterial.

The plurality of light emitting device chips may be light emitting diode(LED) chips. The LED chips may include a GaN-based compoundsemiconductor.

According to another aspect of the present invention, an illuminationapparatus includes: the above-described light emitting device package;and a power supply portion for supplying power to the light emittingdevice package.

The power supply portion may include: an interface for receiving power;and a power controller for controlling power supplied to the lightemitting device package.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings of which:

FIG. 1 is a plan view of a light emitting device package, according toan embodiment of the present invention;

FIG. 2 is a plan view illustrating a location relationship between alead frame used in the light emitting device package of FIG. 1 and alight emitting device chip portion;

FIG. 3 is a side cross-sectional view of the light emitting devicepackage of FIG. 1 cut along a line A-A′ of FIG. 1;

FIG. 4 is an enlarged cross-sectional view of a part B of FIG. 3;

FIG. 5 is a circuit diagram of the light emitting device package of FIG.1;

FIGS. 6 through 9 illustrate various modifications of a light emittingdevice chip mounted on the light emitting device package of FIG. 1;

FIG. 10 is a plan view of a light emitting device package, according toanother embodiment of the present invention;

FIG. 11 is a plan view illustrating a location relationship between alead frame used in the light emitting device package of FIG. 10 and alight emitting device chip portion;

FIG. 12 is a side cross-sectional view of the light emitting devicepackage of FIG. 10 cut along a line C-C′ of FIG. 10;

FIG. 13 is a plan view of a light emitting device package, according toanother embodiment of the present invention;

FIG. 14 is a plan view illustrating a location relationship between alead frame used in the light emitting device package of FIG. 13 and alight emitting device chip portion;

FIG. 15 is a circuit diagram of the light emitting device package ofFIG. 13;

FIGS. 16A through 16G are views illustrating a method of manufacturingthe light emitting device package of FIG. 1, according to an embodimentof the present invention;

FIGS. 17A through 17C are diagrams illustrating lead frame sheets duringmanufacturing of the light emitting device package of FIG. 1; and

FIG. 18 is a block diagram of an illumination apparatus employing alight emitting device package, according to an embodiment of the presentinvention.

DETAILED DESCRIPTION

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings, wherein like referencenumerals refer to like elements throughout. In the drawings, the sizesor thicknesses of elements are exaggerated for clarity.

FIG. 1 is a plan view of a light emitting device package 100, accordingto an embodiment of the present invention, FIG. 2 is a plan viewillustrating a location relationship between a lead frame used in thelight emitting device package 100 of FIG. 1 and a light emitting devicechip portion, FIG. 3 is a side cross-sectional view of the lightemitting device package 100 of FIG. 1 cut along a line A-A′ of FIG. 1,FIG. 4 is an enlarged cross-sectional view of a part B of FIG. 3, andFIG. 5 is a circuit diagram of the light emitting device package 100 ofFIG. 1.

Referring to FIGS. 1 through 5, the light emitting device package 100according to the current embodiment of the present invention includes aplurality of light emitting device chips 130, a lead frame 110electrically connecting the plurality of light emitting device chips 130to the outside, bonding members 120, and reflective cavities 150reflecting light emitted from each of the plurality of light emittingdevice chips 130 and guiding the reflected light to the outside.

The lead frame 110 may be formed as illustrated in FIG. 2 by using ametal plate material such as aluminum or copper through pressing oretching. The lead frame 110 includes a first frame portion 111, a secondframe portion 112, and intermediate connection portions 113, wherein thefirst frame portion 111 and the second frame portion 112 are separatedfrom each other. The first frame portion 111, the second frame portion112, and the intermediate connection portions 113 are bonded and fixedto each other by the bonding members 120 formed of insulating resin andthe reflective cavities 150.

The first frame portion 111 includes a first connection portion 111 a, afirst front terminal 111 b, a first extension portion 111 c, and a firstrear terminal 111 d. The first connection portion 111 a is connected toa negative electrode of a first light emitting device chip 130 adisposed at the foremost of the plurality of light emitting device chips130 that are arranged in a line. The first front terminal 111 b isextended from the first connection portion 111 a in a front enddirection and the first rear terminal 111 d is extended from the firstconnection portion 111 a in a rear end direction. The first extensionportion 111 c that connects the first connection portion 111 a to thefirst rear terminal 111 d is spaced apart from the intermediateconnection portions 113 by a predetermined distance along one side ofthe plurality of light emitting device chips 130 that are arranged in aline.

The second frame portion 112 includes a second connection portion 112 a,a second rear terminal 112 b, a second extension portion 112 c, and asecond front terminal 112 d. The second connection portion 112 a isconnected to a positive electrode of a sixth light emitting device chip130 f disposed at the backmost of the plurality of light emitting devicechips 130 that are arranged in a line. The rear terminal 112 b isextended from the second connection portion 112 a in a rear enddirection and the second front terminal 112 d is extended from thesecond connection portion 112 a in a front end direction. The secondextension portion 112 c that connects the second connection portion 112a to the second front terminal 112 d is spaced apart from theintermediate connection portions 113 by a predetermined distance alongthe other side of the plurality of light emitting device chips 130 thatare arranged in a line.

The first front terminal 111 b and the second front terminal 112 d aredisposed at the foremost of the light emitting device package 100 andthus are used as a negative electrode and a positive electrode,respectively. Also, the first rear terminal 111 d and the second rearterminal 112 b are disposed at the backmost of the light emitting devicepackage 100 and thus are used as a negative electrode and a positiveelectrode, respectively. Thus, the first front terminal 111 b, thesecond front terminal 112 d, the first rear terminal 111 d, and thesecond rear terminal 112 b constitute terminal portions of the lightemitting device package 100. The light emitting device package 100according to the current embodiment of the present invention is fixedinto a socket or other various forms of connector through the exposedterminal portions and thus may be used as an illumination module of anillumination apparatus. Here, soldering of the light emitting devicepackage 100 to a separate PCB is not required. The terminal portionsaccording to the current embodiment of the present invention include thefirst and second front terminals 111 b and 112 d and the first andsecond rear terminals 111 d and 112 b. However, any one of them may beomitted.

The intermediate connection portions 113 are interposed between thefirst connection portion 111 a and the second connection portion 112 a.The intermediate connection portions 113 are disposed between theplurality of light emitting device chips 130 to connect positiveelectrodes thereof to negative electrodes thereof. The number ofintermediate connection portions 113 may be less than the number ofplurality of light emitting device chips 130 by one. For example, asillustrated in the drawings, when six light emitting device chips 130exist, five intermediate connection portions 113 exist.

The intermediate connection portions 113 connects the plurality of lightemitting device chips 130 in series along with the connection portion111 a and the second connection portion 112 a in a circuit. A circuit ofthe plurality of light emitting device chips 130 may be similar to thatillustrated in FIG. 5.

A plurality of mounting portions 115 to which each of the plurality oflight emitting device chips 130 is mounted are prepared on theintermediate connection portions 113 and the second connection portion112 a. That is, the plurality of mounting portions 115 are each preparedon some areas of the intermediate connection portions 113 and the secondconnection portion 112 a, and bonding pads (not illustrated) whichfacilitate bonding of the plurality of light emitting device chips 130may be attached to the plurality of mounting portions 115. In FIG. 2,reference numeral 116 indicates areas where the reflective cavities 150are prepared, that is, reflective cavity formation portions. Thereflective cavity formation portions 116 are formed throughout the firstconnection portion 111 a, the intermediate connection portions 113, andthe second connection portion 112 a so that the first connection portion111 a, the intermediate connection portions 113, and the secondconnection portion 112 a are fixed and bonded by the reflective cavities150.

In addition, insulating layers (not illustrated) formed by being coatedwith an insulating material may be formed on areas other than parts forelectrically connecting the plurality of light emitting device chips 130or the terminal portions. The insulating layers may be formed of a samematerial as the reflective cavities 150 and may be formed together withthe reflective cavities 150.

The plurality of light emitting device chips 130 may be light emittingdiode (LED) chips including a positive electrode and negative electrode.The LED chips may emit blue light, green light, and red light accordingto materials of a compound semiconductor that forms the LED chips. Also,the LED chips may be coated with a fluorescent material and thus mayemit white light. For example, a blue LED chip may include an activelayer having a plurality of quantum well structures in which GaN andInGaN are alternately formed. A P-type clad layer and an N-type cladlayer, both of which are formed of a compound semiconductor ofAl_(X)Ga_(Y)N_(Z), may be formed on the upper side and the lower side ofthe active layer, respectively. In addition, a light diode chipdisclosed in Korean Patent Application No. 2010-015422 or No.2010-018259 may be used as the light emitting device chip according tothe current embodiment of the present invention. In the currentembodiment, the light emitting device chips are the LED chips. However,the present invention is not limited thereto and the plurality of lightemitting device chips 130 may be, for example, UV light diode chips,laser diode chips, or organic light emitting diode (OLED) chips.

The plurality of light emitting device chips 130 are arranged in a lineand are connected to the lead frame 110 in series in a circuit. Asillustrated in FIG. 4, substrate surfaces of each of the plurality oflight emitting device chips 130 are bonded to the intermediateconnection portions 113 of the lead frame 110 or the second connectionportion 112 a and wires 141 and 142 are electrically wired to the firstconnection portion 111 a, the intermediate connection portions 113, andthe second connection portion 112 a that are spaced apart from eachother. Gaps G through which the first connection portion 111 a, theintermediate connection portions 113, and the second connection portion112 a are spaced apart from each other may be filled with the samematerial as the reflective cavities 150 or may be empty.

In the current embodiment, six light emitting device chips 130 areprepared. However, the present invention is not limited thereto and thenumber of the light emitting device chips 130 may be appropriatelyselected according to a source of an illumination apparatus employingthe light emitting device package 100. Also, in the current embodiment,the lead frame 110 has a repetitive pattern along an arranged directionof the light emitting device chips 130. Accordingly, the number ofintermediate connection portions 113 may be easily changed according tothe number of required light emitting device chips 130.

The reflective cavities 150 may be prepared for each of the plurality oflight emitting device chips 130. The reflective cavities 150 reflectlight emitted from the plurality of light emitting device chips 130toward reflective surfaces 150 a and allow the reflected light to beemitted at a predetermined angle range. Also, extraction efficiency oflight emitted from the plurality of light emitting device chips 130 tothe outside may be improved due to the reflective cavities 150. Thereflective cavities 150 may be formed through an injection process atthe same time as the bonding members 120 are formed. In this case, thereflective cavities 150 may be formed of the same insulating material asthe bonding members 120. Examples of the insulating material may includeepoxy resin, silicon resin, and plastic.

The plurality of light emitting device chips 130 may each be mounted onthe inside of the reflective cavities 150 and then transmissible resins160 may be each filled in the reflective cavities 150 to protect theplurality of light emitting device chips 130. In addition, thetransmissible resin 160 includes a fluorescent material and thus mayemit predetermined fluorescent light. For example, when the plurality oflight emitting device chips 130 are blue LED chips or UV light diodechips, the transmissible resins 160 may include yellow, red, and greenfluorescent powder and thus may emit white light. Examples of thefluorescent material may include a nitride-based fluorescent material, asulfide-based fluorescent material, and a fluorescent material using asilicate-based fluorescent material or quantum dots.

In the current embodiment, the plurality of light emitting device chips130 may be mounted in the reflective cavities 150 using wire bonding.However, the present invention is not limited thereto.

FIGS. 6 through 9 illustrate various modifications of the light emittingdevice chip 130 mounted in the light emitting device package 100 of FIG.1.

Referring to FIG. 6, a lens 170 may be further prepared on thereflective cavities 150 to which the light emitting device chip 130 ismounted. The lens 170 may collect or diffuse light emitted from thelight emitting device chip 130 so as to facilitate designing of lightdistribution. The lens 170 may be formed of transparent resin or glassand may be directly formed on the reflective cavity 150. Also, the lens170 may be separately formed and then attached to the reflective cavity150. The transmissible resin 160 and the lens 170 may be integrallyformed with each other as a single body. Here, the embodiment of FIG. 6is substantially the same as the previous embodiment except that thelens 170 is further prepared and thus a detailed description thereofwill not be repeated.

In the previous embodiment, the reflective cavities 150 are prepared.However, the present invention is not limited thereto and the reflectivecavities may be omitted as illustrated in FIGS. 7 and 8.

In FIG. 7, a transmissible resin 161 is directly coated on thewire-bonded light emitting device chip 130 without the reflectivecavity. Various fluorescent materials are added to the transmissibleresin 161 so that white light or other fluorescent colors may beemitted. In addition, as illustrated in FIG. 7, a lens 171 is furtherprepared on the transmissible resin 161 and thus may adjust thedistribution of light by converging or diffusing light emitted from thelight emitting device chip 130. The transmissible resin 161 and the lens171 may be integrally formed with each other as a single body.

In FIG. 8, a light emitting device chip 131 is flip chip bonded to asubstrate. In this case, the light emitting device chip 131 iselectrically connected to the lead frame 110 by bumps 145 and 146 formedof a conductive material such as gold. In flip chip bonding, light fromthe light emitting device chip 131 is emitted through a surface oppositeto the surfaces to which the light emitting device chip 131 is bonded. Atransmissible resin 162 may be coated on the flip chip bonded lightemitting device chip 131. A fluorescent material may be diffused to thetransmissible resin 162. The transmissible resin 162 may cover the lightemitting device chip 131 in the form of a film. In addition, a lens 172may be further formed on the transmissible resin 162.

As illustrated in FIGS. 7 and 8, when the reflective cavities do notexist, the first connection portion 111 a, the intermediate connectionportions 113, and the second connection portion 112 a in the lead frame110 may be bonded through the transmissible resins 161 and 162 and thelenses 171 and 172 or may be fixed and bonded through separate bondingmembers (not illustrated).

In FIGS. 1 through 8, the plurality of mounting portions to which theplurality of light emitting device chips 130 and 131 are mounted areprepared on the connection portions 111 a, 112 a, and 113 for electricalconnection. However, the present invention is not limited thereto andthe mounting portions may be disposed between the connection portions.Referring to FIG. 9, a lead frame 110′ includes a bending portion 110′aand a heat slug 118 is disposed in a space prepared by the bendingportion 110′ a to be spaced apart from the bending portion 110′a. Theheat slug 118 is fixed and bonded to the lead frame 110′ through fixingmembers 119. The heat slug 118 is used as a mounting portion to whichthe light emitting device chip 130 is mounted. That is, the lightemitting device chip 130 is attached to the heat slug 118 and iselectrically connected to the bending portion 110′ a of the lead frame110′ through wires 141 and 142. The heat slug 118 is formed of a metalhaving excellent heat conductivity and thus is used as a path foremitting light generated from the light emitting device chip 130. Also,the light emitting device chip 130 may be coated with a transmissibleresin 163, wherein the transmissible resin 163 may include a fluorescentmaterial. In addition, the light emitting device chip 130 may besurrounded by a reflective cavity 150′ and a lens 173 may be formedthereon. In the embodiment of FIG. 9, the heat slug 118 is used toimprove heat radiation. However, various well-known heat radiationstructures may be employed.

FIG. 10 is a plan view of a light emitting device package 101, accordingto another embodiment of the present invention, FIG. 11 is a plan viewillustrating a location relationship between a lead frame used in thelight emitting device package 101 of FIG. 10 and a light emitting devicechip portion, and FIG. 12 is a side cross-sectional view of the lightemitting device package 101 of FIG. 10 cut along a line C-C′ of FIG. 10.In FIG. 12, wires are not illustrated.

In the light emitting device package 101 according to the currentembodiment of the present invention, elements other than reflectivecavities 151 are the same as those in the light emitting device package101 described with reference to FIGS. 1 through 5. Thus, only thereflective cavities 151 will be described in detail.

Referring to FIGS. 10 through 12, the reflective cavities 151 areextended in a direction perpendicular to an arrangement direction of theplurality of light emitting device chips 130 and thus cover the firstextension portion 111 c and the second extension portion 112 c. That is,reflective cavities formation portions 116′ include the outside of thefirst extension portion 111 c and the second extension portion 112 c.The reflective cavities 151 may be formed of insulating resin. As thereflective cavities 151 are extended to the first extension portion 111c and the second extension portion 112 c, the first connection portion111 a, the intermediate connection portions 113, and the secondconnection portion 112 a are not only fixed and bonded but also thefirst extension portion 111 c and the second extension portion 112 c maybe fixed and bonded. Accordingly, in the current embodiment of thepresent invention, the lead frame 110 is fixed by the reflectivecavities 151 without separate bonding members 120 of FIG. 1. Inaddition, the reflective cavities 151 cover the outside of the firstextension portion 111 c and the second extension portion 112 c and thusthe light emitting device package 101 may have an improved insulationproperty.

As illustrated in FIG. 12, the reflective cavities 151 may be formedonly on the lead frame 110 to which the plurality of light emittingdevice chips 130 are mounted. In this case, the lower side of the leadframe 110 is exposed so as to efficiently emit light generated from theplurality of light emitting device chips 130. In some cases, thereflective cavities 151 may be formed to surround the lower side of thelead frame 110.

The reflective cavities 151 are formed for each of the plurality oflight emitting device chips 130 and are spaced apart from each other.However, the present invention is not limited thereto and the reflectivecavities 151 may be formed to cover areas other than mounting portionsof the plurality of light emitting device chips 130 and terminalportions.

FIG. 13 is a plan view of a light emitting device package 200, accordingto another embodiment of the present invention, FIG. 14 is a plan viewillustrating a location relationship between a lead frame used in thelight emitting device package 200 of FIG. 13 and a light emitting devicechip portion, and FIG. 15 is a circuit diagram of the light emittingdevice package 200 of FIG. 13.

In the light emitting device package 200 according to the currentembodiment of the present invention, a plurality of light emittingdevice chips 230 are arranged in parallel. Referring to FIGS. 13 through15, the light emitting device package 200 includes a lead frame 210, theplurality of light emitting device chips 230, and reflective cavities250.

As illustrated in FIG. 14, the lead frame 210 includes a first frameportion 211 and a second frame portion 212 and has the form of a longbar. Both ends of the first frame portion 211 are extended a long way soas to form a first front terminal 211 a and a first rear terminal 211 b.Also, both ends of the second frame portion 212 are extended a long wayso as to form a second front terminal 212 a and a second rear terminal212 b. The first frame portion 211 and the second frame portion 212 arespaced apart from each other by a predetermined distance and a pluralityof mounting portions 215 are formed on one side of the first frameportion 211 and the second frame portion 212. The light emitting devicechips 230 are each mounted on the mounting portions 215 and electricwiring is accomplished through various well known bonding methods suchas wire bonding or flip chip bonding. The reflective cavities 250 areformed to cover the first frame portion 211 and the second frame portion212. Accordingly, the reflective cavities 250 reflects light emittedfrom the light emitting device chips 230 towards a predetermineddirection and bonds the first frame portion 211 to the second frameportion 212.

The light emitting device chips 230 may be LED chips including apositive electrode and a negative electrode. For example, positiveelectrodes of the light emitting device chips 230 may be commonly andelectrically connected to the first frame portion 211 and negativeelectrodes of the light emitting device chips 230 may be commonly andelectrically connected to the second frame portion 212. Accordingly, asillustrated in FIG. 15, the light emitting device chips 230 areconnected in parallel by the first frame portion 211 and the secondframe portion 212.

FIGS. 16A through 16G are views illustrating a method of manufacturingthe light emitting device package 100 of FIG. 1, according to anembodiment of the present invention and FIGS. 17A through 17C arediagrams illustrating lead frame sheets during manufacturing of thelight emitting device package 100 of FIG. 1.

Firstly, the lead frame 110 as illustrated in FIGS. 16A and 16B isprepared. FIG. 16A is a plan view of the lead frame 110 and FIG. 16B isa side cross-sectional view of the lead frame 110. A material andthickness of the lead frame 110 may be well-known. For example, the leadframe 110 may be patterned as illustrated in FIG. 16A by using a metalplate material such as aluminum or copper having a sub-millimeterthickness through pressing or etching. The lead frame 110 is connectedand supported by the first frame portion 111, the second frame portion112, the intermediate connection portions 113, and cleavage portions117.

The lead frame 110 illustrated in FIGS. 16A and 16B are in one lightemitting device package portion. As illustrated in FIG. 17A, a pluralityof lead frames 110 may be formed on one lead frame sheet 300.

Then, as illustrated in FIGS. 16C and 16D, the reflective cavities 150are formed on the lead frame 110. The reflective cavities 150 may beformed of plastic such as silicon resin or epoxy resin through injectionmolding. When the reflective cavities 150 are formed, the bondingmembers 120 may be also formed, wherein the bonding members 120 bond thefirst frame portion 111 to the intermediate connection portions 113 andthe second frame portion 112 to the intermediate connection portions113. In some cases, the reflective cavities 150 may be extended asillustrated in FIG. 10 and the bonding members 120 may be removed. Thereflective cavities 150 and the bonding members 120 are formed in thelead frame sheet 300, as illustrated in FIG. 17B.

Then, as illustrated in FIGS. 16E and 16F, the plurality of lightemitting device chips 130 are mounted on the lead frame 110. Theplurality of light emitting device chips 130 may be die-attached tomounting portions of the lead frame 110 (refer to the mounting portions115 of FIG. 2). Then, the plurality of light emitting device chips 130are electrically wired using wires and the reflective cavities 150 arefilled with transparent resin. In some case, lenses may be furtherprepared.

Then, as illustrated in FIG. 16G, the cleavage portions 117 of the leadframe 110 are removed and thus the lead frame 110 is separated, therebycompleting manufacture of the light emitting device package 100. In FIG.17C, the cleavage portions 117 are removed from the lead frame sheet300.

In some cases, the cleavage portions 117 of the light emitting devicepackage 100 may be removed before the plurality of light emitting devicechips 130 are mounted and then electrically wired, and transparent resinis filled therein. When the cleavage portions 117 are removed, theplurality of light emitting device chips 130 are circuit connected.Thus, power may be supplied thereto so that an electrical wiring stateor a light emission state of the plurality of light emitting devicechips 130 may be tested. In this case, each of the light emitting devicepackages 100 may be attached in the lead frame sheet 300 using a wellknown method (for example, tie bar).

FIG. 18 is a block diagram of an illumination apparatus 400 employing alight emitting device package, according to an embodiment of the presentinvention.

Referring to FIG. 18, the illumination apparatus 400 according to thecurrent embodiment of the present invention includes an illuminationmodule 490 and a power supply portion 410 which supplies power to theillumination module 490.

The illumination module 490 may be the light emitting device packagedescribed with reference to FIGS. 1 through 15.

The power supply portion 410 may include an interface 420 that receivespower and a power controller 430 that controls power supplied to theillumination module 490. The interface 420 may include a fuse thatblocks an excessive current and an electromagnetic wave shielding filterthat shields the interface 420 from an electromagnetic interferencesignal. Power may be supplied from the outside from aninternally-installed battery. When an alternating power is input aspower, the power controller 430 may further include a rectificationportion and a constant voltage controller, wherein the rectificationportion converts an alternating current (AC) into a direct current (DC)and the constant voltage controller converts voltage into voltageappropriate to the illumination module 490. When the power is a DCsource having voltage appropriate to the illumination module 490 (forexample, a battery), the rectification portion or the constant voltagecontroller may be omitted. Also, when a device such as AC-LED isemployed as a light emitting device chip of the illumination module 490,alternating power may be directly supplied to the illumination module490. In this case, the rectification portion or the constant voltagecontroller may be also omitted. In addition, the power controller 430may control color temperature and may realize lighting presentationaccording to human sensitivity.

The light emitting device package used as the illumination module 490packages a plurality of light emitting device chips into one module inorder to secure sufficient light. As a general illumination module,light emitting device chips (for example, LED chips) are firstlypackaged in the lead frame together with fluorescent materials andlenses and the firstly packaged light emitting device chips are secondlypackaged by connecting the firstly packaged light emitting device chipsin series and/or in parallel to be mounted on a printed circuit board(PCB). However, in the illumination apparatus 400 according to thecurrent embodiment of the present invention, the light emitting devicepackage 100 of FIG. 1, 101 of FIG. 10, or 200 of FIG. 13, packaged byconnecting the plurality of light emitting device chips 130 of FIG. 1 or230 of FIG. 13 in series and/or in parallel in the lead frame 110 ofFIG. 1 or 210 of FIG. 13, is used as the illumination module. It isimportant to reduce manufacturing costs when commercializing a LED as anew light source of an illumination apparatus instead of a low-pricedlight source such as a fluorescent lamp. According to the embodiments ofthe present invention, circuits of the light emitting device chips arerealized in the lead frame 110 or 210 and thus the light emitting devicepackage 100, 101, or 200 may be directly used as an illumination moduleof an illumination apparatus through a single packaging process so thatpackaging may be simplified and manufacturing costs of an illuminationmodule may be reduced.

It should be understood that the exemplary embodiments described hereinshould be considered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

1. A lead frame for a light emitting device package comprising: aplurality of mounting portions on which a plurality of light emittingdevice chips are mounted, respectively; a plurality of connectionportions for circuit connecting the plurality of light emitting devicechips; a terminal portion extended from at least one of the plurality ofconnection portions; and a plurality of cleavage portions for connectingthe plurality of mounting portions, the plurality of connectionportions, and the terminal portion, wherein the cleavage portions arecut after the plurality of light emitting device chips are mounted. 2.The lead frame of claim 1, wherein the plurality of connection portionscomprise intermediate connection portions, a first connection portion,and a second connection portion, the intermediate connection portionsconnecting the plurality of light emitting device chips in series, thefirst connection portion electrically connected to a first electrode ofthe light emitting device chip disposed at the foremost of a seriescircuit in which the plurality of light emitting device chips arearranged in series, and the second connection portion electricallyconnected to a second electrode of the light emitting device chipdisposed at the rearmost of a series circuit in which the plurality oflight emitting device chips are arranged in series, and wherein theterminal portion comprises a first terminal extended from the firstconnection portion and a second terminal extended from the secondconnection portion.
 3. The lead frame of claim 2, wherein the firstconnection portion, the intermediate connection portions, and the secondconnection portion are arranged in a line, the first terminal comprisesa first front terminal disposed at the foremost in the line arrangementand a first rear terminal disposed at the rearmost in the linearrangement, the second terminal comprises a second front terminaldisposed at the foremost in the line arrangement and a second rearterminal disposed at the rearmost in the line arrangement, and theplurality of connection portions comprise a first extension portionextended from the first connection portion to the first rear terminalalong one side of the line arrangement and a second extension portionextended from the second connection portion to the second front terminalalong the other side of the line arrangement.
 4. The lead frame of claim1, wherein the plurality of connection portions comprise the firstconnection portion commonly connected to the first electrodes of theplurality of light emitting device chips and the second connectionportion commonly connected to the second electrodes of the plurality oflight emitting device chips so as to connect the plurality of lightemitting device chips in parallel.
 5. A light emitting device packagecomprising: a plurality of light emitting device chips; and a lead framecomprising: a plurality of mounting portions to which the plurality oflight emitting device chips are mounted; a plurality of connectionportions for circuit connecting the plurality of light emitting devicechips; and a terminal portion extended from at least one of theplurality of connection portions.
 6. The light emitting device packageof claim 5, wherein the plurality of light emitting device chipscomprise first and second light emitting device chips, the plurality ofconnection portions comprise a first connection portion electricallyconnected to a first electrode of the first light emitting device chips,intermediate connection portions electrically connected to a secondelectrode of the first light emitting device chip and a first electrodeof the second light emitting device chip, and a second connectionportion electrically connected to a second electrode of the second lightemitting device chip, and the terminal portion comprises a firstterminal extended from the first connection portion and a secondterminal extended from the second connection portion.
 7. The lightemitting device package of claim 5, wherein the plurality of connectionportions comprise intermediate connection portions electricallyconnecting the plurality of light emitting device chips in series, afirst connection portion electrically connected to a first electrode ofthe light emitting device chip disposed at the foremost of a seriescircuit in which the plurality of light emitting device chips arearranged in series, and a second connection portion electricallyconnected to a second electrode of the light emitting device chipdisposed at the rearmost of a series circuit in which the plurality oflight emitting device chips are arranged in series, and the terminalportion comprises a first terminal extended from the first connectionportion and a second terminal extended from the second connectionportion.
 8. The light emitting device package of claim 7, wherein theplurality of light emitting device chips are arranged in a line.
 9. Thelight emitting device package of claim 8, wherein the first terminalcomprises a first front terminal disposed at the foremost of theplurality of light emitting device chips in the line arrangement and afirst rear terminal disposed at the rearmost of the plurality of lightemitting device chips in the line arrangement, the second terminalcomprises a second front terminal disposed at the foremost of theplurality of light emitting device chips in the line arrangement and asecond rear terminal disposed at the rearmost of the plurality of lightemitting device chips in the line arrangement, and the plurality ofconnection portions comprise a first extension portion extended from thefirst connection portion to the first rear terminal along one side ofthe plurality of light emitting device chips in the line arrangement anda second extension portion extended from the second connection portionto the second front terminal along the other side of the plurality oflight emitting device chips in the line arrangement.
 10. The lightemitting device package of claim 9, wherein the lead frame is in theform of a long bar extended in a direction of the first and secondextension portion.
 11. The light emitting device package of claim 9,wherein the first extension portion and the second extension portion arebonded to each other by the intermediate connection portions and bondingmembers formed of an insulating material.
 12. The light emitting devicepackage of claim 11, wherein the bonding members are extended to theoutside of at least a part of the first extension portion and the secondextension portion.
 13. The light emitting device package of claim 12,wherein the bonding members are integrally formed with reflectivecavities as a single body, the reflective cavities reflecting lightemitted from the plurality of light emitting device chips.
 14. The lightemitting device package of claim 8, further comprising reflectivecavities that reflect light emitted from the plurality of light emittingdevice chips, wherein the reflective cavities connect the firstconnection portion, the intermediate connection portions, and the secondconnection portion to each other.
 15. The light emitting device packageof claim 5, wherein the plurality of connection portions comprise thefirst connection portion commonly connected to first electrodes of theplurality of light emitting device chips and the second connectionportion commonly connected to second electrodes of the plurality oflight emitting device chips so as to connect the plurality of lightemitting device chips in parallel, and the terminal portion comprises afirst terminal extended from the first connection portion and a secondterminal extended from the second connection portion.
 16. The lightemitting device package of claim 5, wherein at least a part of the leadframe is insulation-coated.
 17. The light emitting device package ofclaim 5, wherein the plurality of mounting portions are prepared in apart of the plurality of connection portions.
 18. The light emittingdevice package of claim 17, wherein the plurality of mounting portions,the plurality of connection portions, and the terminal portion areformed of the same material.
 19. The light emitting device package ofclaim 5, wherein the plurality of mounting portions are disposed betweenthe plurality of connection portions, and the plurality of mountingportions and the plurality of connection portions are formed of aninsulating material.
 20. The light emitting device package of claim 19,wherein the plurality of mounting portions are formed of a heatconducting material.
 21. The light emitting device package of claim 5,wherein the plurality of light emitting device chips are eachwire-bonded to the plurality of connection portions.
 22. The lightemitting device package of claim 5, wherein the plurality of lightemitting device chips are each flip chip bonded to the plurality ofconnection portions.
 23. The light emitting device package of claim 5,further comprising reflective cavities that reflect light emitted fromthe plurality of light emitting device chips.
 24. The light emittingdevice package of claim 5, further comprising a lens that bends lightemitted from the plurality of light emitting device chips.
 25. The lightemitting device package of claim 5, wherein the plurality of lightemitting device chips are covered with a transmissible resin.
 26. Thelight emitting device package of claim 23, wherein the transmissibleresin comprises a fluorescent material.
 27. The light emitting devicepackage of claim 5, wherein the plurality of light emitting device chipsare light emitting diode (LED) chips.
 28. The light emitting devicepackage of claim 27, wherein the LED chips comprise a GaN-based compoundsemiconductor.
 29. An illumination apparatus comprising: a lightemitting device package; and a power supply portion for supplying powerto the light emitting device package, wherein the light emitting devicepackage comprises: a plurality of light emitting device chips; and alead frame for electrically connecting the plurality of light emittingdevice chips to the outside, the lead frame comprising: a plurality ofmounting portions to which the plurality of light emitting device chipsare mounted; a plurality of connection portions for circuit connectingthe plurality of light emitting device chips; and a terminal portionextended from at least one of the plurality of connection portions. 30.The apparatus of claim 29, wherein the plurality of light emittingdevice chips comprise first and second light emitting device chips, theplurality of connection portions comprise a first connection portionelectrically connected to a first electrode of the first light emittingdevice chips, intermediate connection portions electrically connected toa second electrode of the first light emitting device chip and a firstelectrode of the second light emitting device chip, and a secondconnection portion electrically connected to a second electrode of thesecond light emitting device chip, and the terminal portion comprises afirst terminal extended from the first connection portion and a secondterminal extended from the second connection portion.
 31. The apparatusof claim 29, wherein the plurality of connection portions compriseintermediate connection portions electrically connecting the pluralityof light emitting device chips in series, a first connection portionelectrically connected to a first electrode of the light emitting devicechip disposed at the foremost of a series circuit in which the pluralityof light emitting device chips are arranged in series and a secondconnection portion electrically connected to a second electrode of thelight emitting device chip disposed at the backmost of a series circuitin which the plurality of light emitting device chips are arranged inseries, and the terminal portion comprises a first terminal extendedfrom the first connection portion and a second terminal extended fromthe second connection portion.
 32. The apparatus of claim 31, whereinthe plurality of light emitting device chips are arranged in a line, thefirst terminal comprises a first front terminal disposed at the foremostof the plurality of light emitting device chips in the line arrangementand a first rear terminal disposed at the rearmost of the plurality oflight emitting device chips in the line arrangement, the second terminalcomprises a second front terminal disposed at the foremost of theplurality of light emitting device chips in the line arrangement and asecond rear terminal disposed at the rearmost of the plurality of lightemitting device chips in the line arrangement, and the plurality ofconnection portions comprise a first extension portion extended from thefirst connection portion to the first rear terminal along one side ofthe plurality of light emitting device chips in the line arrangement anda second extension portion extended from the second connection portionto the second front terminal along the other side of the plurality oflight emitting device chips in the line arrangement.
 33. The apparatusof claim 32, wherein the light emitting device package is in the form ofa long bar extended in a direction of the plurality of light emittingdevice chips arranged in a line.
 34. The apparatus of claim 32, whereinthe first extension portion and the second extension portion are bondedto each other by the intermediate connection portions and bondingmembers formed of an insulating material, and the bonding members areextended to the outside of at least a part of the first extensionportion and the second extension portion.
 35. The apparatus of claim 34,wherein the bonding members are integrally formed with reflectivecavities as a single body, the reflective cavities reflecting lightemitted from the plurality of light emitting device chips.
 36. Theapparatus of claim 32, further comprising reflective cavities thatreflect light emitted from the plurality of light emitting device chips,wherein the reflective cavities connect the first connection portion,the intermediate connection portions, and the second connection portionto each other.
 37. The apparatus of claim 29, wherein the plurality ofconnection portions comprise the first connection portion commonlyconnected to first electrodes of the plurality of light emitting devicechips and the second connection portion commonly connected to secondelectrodes of the plurality of light emitting device chips so as toconnect the plurality of light emitting device chips in parallel, andthe terminal portion comprises a first terminal extended from the firstconnection portion and a second terminal extended from the secondconnection portion.
 38. The apparatus of claim 29, wherein the pluralityof mounting portions are prepared in a part of the plurality ofconnection portions.
 39. The apparatus of claim 29, wherein theplurality of mounting portions formed of a heat conducting material aredisposed between the plurality of connection portions and the pluralityof mounting portions and the plurality of connection portions are formedof an insulating material.
 40. The apparatus of claim 29, wherein thepower supply portion comprises: an interface for receiving power; and apower controller for controlling power supplied to the light emittingdevice package.